Samme termiske egenskaper på 65 nm

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Intel Corp.’s Paul Otellini disclosed some of the details concerning the company’s forthcoming dual-core desktop processors. Apparently, the chips’ clock-speed will increase in future even despite “more aggressive” thermal envelopes, but in the long-term desktop chips may become less power hungry. Still, the first 65nm chips will fit into current thermal specifications.

 

Thermal Specs of Desktop Chips to Come Down

 

“As we move dual-core in the desktop, particularly in the Extreme Edition, you’ll see us continue to drive the clock-speed within a more aggressive power envelope than those machines can handle. I don’t think 4.00GHz is necessarily a fundamental limit… The thermal envelope is the key and I do believe that it’ll come down even in the desktops,” said Intel’s President and COO.

 

When asked about thermal envelope for dual-core desktop and mobile processors made using 65nm process technology, the company’s executive said they would fit into existing thermal envelopes, but eventually thermal design power of such chips will be reduced from the current level of 130W.

 

“The initial products will fit inside existing mobile and desktop power envelopes. Then will try to bring out derivative versions and take that down over time as we crank up architectural features… We are certainly not trying to take that up,” Mr. Otellini said.