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Stacking is a fundamental strength of the Thin Film technology. The polymer memory layers are just 1/10,000 of a millimetre or less in thickness, autonomous and easy to deposit. Layer upon layer may be coated on a substrate. A layer may include a self-contained active memory structure with on-layer circuitry and TFT, or share circuitry (as in hybrid polymer-over-silicon chips). In the latter case, stacked layers may be individually addressed from the bottom circuitry, giving three dimensional storage capacity.

The Thin Film memory system is expandable: by the addition of new layers, manufacturers will be able to gain previously unattainable storage capacity within a given footprint.

Examples:

The equivalent of 400,000 CDs, or 60,000 DVDs, or 126 years of MPG music may be stored on a polymer memory chip the size of a credit card.

 

 

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